High Resolution and Low Stress Photo-Definable Polyimide

Recently, realization of 5G communication systems attract much attention, and high functionality and miniaturizations of semi-conductor devices and electronic devices are required. For these purposes, the polyimides applied as interlayer dielectrics of these devices are expected to show high resolut...

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Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 36; no. 4; pp. 227 - 230
Main Authors Sakai, Tomoki, Okuda, Yumiko, Kato, Keigo, Matsumura, Kazuyuki, Araki, Hitoshi
Format Journal Article
LanguageEnglish
Japanese
Published Hiratsuka The Society of Photopolymer Science and Technology(SPST) 15.06.2023
Japan Science and Technology Agency
Subjects
Accelerated tests
Communications systems
High resolution
Interlayers
Light transmittance
Low shrinkage
Low stress
Low temperature cure
Patterning
Photo-definable Polyimide
Polyimide resins
Reliability
Residual stress
Thick films
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Summary:Recently, realization of 5G communication systems attract much attention, and high functionality and miniaturizations of semi-conductor devices and electronic devices are required. For these purposes, the polyimides applied as interlayer dielectrics of these devices are expected to show high resolution and reliability in thick films. In this paper, we worked on developing high resolution and low stress negative tone photo-definable polyimide. By combining with high light transmittance polyimide and the UV cure system that suppress active species, we successfully obtained the fine patterns with high resolution even at 40 μm thickness. We also employed the thermal cure system with no cure shrinkage, so that the residual stress was still low even at dry conditions. Our developed polyimide also showed a good insulation reliability by biased HAST (High Accelerated Stress Test).
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.36.227