Hot Melt Super Glue: Multi‐Recyclable Polyphenol‐Based Supramolecular Adhesives

• Published in: Macromolecular rapid communications. Vol. 43; no. 7; pp. e2100830 - n/a
• Main Authors: Liu, Hanru, Geng, Huimin, Zhang, Xiaohui, Wang, Xu, Hao, Jingcheng, Cui, Jiwei
• Format: Journal Article
• Language: English
• Published: Germany Wiley Subscription Services, Inc 01.04.2022
• Subjects: Adhesion; Adhesive strength; Adhesives; Bond strength; Bonding strength; Catechol; Hydrogen Bonding; Hydrogen bonds; Hydroxyl groups; Low temperature; Molecular weight; Organic solvents; poly(ethylene glycol); Polyethylene glycol; Polyethylene Glycols - chemistry; Polyphenols; Pyrogallol; Solvents; Substrates; supramolecular adhesion; supramolecular adhesion; polyphenols; poly(ethylene glycol); adhesives; hydrogen bonds
• ISSN: 1022-1336; 1521-3927; 1521-3927
• DOI: 10.1002/marc.202100830

The rapid and facile synthesis of hot melt super glue (HMSG) via the formation of adhesive supramolecular networks between catechol or pyrogallol hydroxyl groups (−OH) of polyphenols and repeat units (−CH2CH2O−) of poly(ethylene glycol) (PEG) based on hydrogen bonds is reported. The adhesion strength of HMSG, processed by heating–cooling of polyphenols and PEG without additional solvents, can be tuned up to 8.8 MPa via changing the molecular weight of PEG and the ratio of hydrogen bonding donors and receptors. The advantages of the reported HMSG lie in the ease and scalability of the assembly process, rapid adhesion on various substrates with excellent processability, resistance of low temperature and organic solvents, and recyclable adhesion strength. The solvent‐free HMSG represents a promising adhesive supramolecular network to expand the versatility and application of polyphenol‐based materials. Solvent‐free hot melt super glue (HMSG) is fabricated via the formation of supramolecular networks composed of poly(ethylene glycol) and polyphenols based on hydrogen bonds. HMSG is capable of strong recyclable adhesions on various substrates with resistance of low temperature and organic solvent, which expands the versatility of mussel‐inspired polyphenol chemistry for the engineering of solvent‐free adhesive materials.