Effects of T6 heat treatment on the microstructure, tensile properties, and fracture behavior of the modified A356 alloys

• Published in: Materials in engineering Vol. 36; pp. 243 - 249
• Main Authors: Zhu, Man, Jian, Zengyun, Yang, Gencang, Zhou, Yaohe
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.04.2012
• Subjects: Fracture; Heat treatments; Microstructure; Microstructure; Heat treatments; Fracture
• ISSN: 0261-3069
• DOI: 10.1016/j.matdes.2011.11.018

► The size of eutectic silicon is reduced, and its speroidization degree increases. ► Mischmetal addition leads to a improvement of yield, ultimate tensile and elongation. ► Ductile fracture is responsible for the MM-modified alloys. ► Eutectic silicon and RE-containing intermetallic compounds provide the weak locations. It is known that heat treatment causes the spheroidization of eutectic silicon. This paper presents the influence of T6 heat treatment on the microstructures, tensile properties, and fracture behavior of the A356 alloys modified by mischmetal containing La and Ce elements. Microstructural analysis showed that the size of eutectic silicon particles was greatly reduced and the extent of speroidisation of Si particles was remarkably improved for the modified A356 alloys. Comparison between the unmodified and modified alloys suggested that the values of mean diameter, roundness, and aspect ration of eutectic silicon particles were decreased by 48.10–56.85%, 49.55–54.52%, and 13.36–30.17%, respectively. The tensile properties of the modified A356 alloys can be enhanced, especially the ductility. These could be associated with the decrease of secondary dendrite arm spacing, spheroidization of fine eutectic silicon and precipitation hardening. Scanning electron microscopy (SEM) examination indicated that the ductile fracture mechanism was responsible for the modified alloys due to the existence of a couple of fine and uniformly distributed dimples. And the eutectic silicon particles and RE-containing intermetallic compounds provide the weak locations during the fracture process.