Electroplating and Properties of SnBi and SnCu for Lead-Free Finishes

Tin alloys such as Sn-0.7% Cu and Sn-2%Bi were identified as viable alternatives to tin-lead finishes. Electroplating of these alloys is challenging because of the great difference in reduction potentials of the individual elements and the usual problems associated with strong immersion deposition a...

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Bibliographic Details
Published inTransactions of the Institute of Metal Finishing Vol. 80; no. 6; pp. 200 - 204
Main Authors Khaselev, O., Zavarine, I. S., Vysotskaya, A., Fan, C., Zhang, Y., Abys, J.
Format Journal Article
LanguageEnglish
Published Birmingham Taylor & Francis 2002
Institute of Metal Finishing
Subjects
Applied sciences
Exact sciences and technology
Metallic coatings
Metals. Metallurgy
Production techniques
Surface treatment
Cathodic polarization
Differential scanning calorimetry
Bismuth base alloys
Tin alloy
Electrodeposition
Experimental study
Coatings
Surface treatment
Binary alloy
Copper alloy
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Summary:Tin alloys such as Sn-0.7% Cu and Sn-2%Bi were identified as viable alternatives to tin-lead finishes. Electroplating of these alloys is challenging because of the great difference in reduction potentials of the individual elements and the usual problems associated with strong immersion deposition and poor alloy control. To overcome these problems we utilised metal-specific non-complexing organic additives, which can significantly slow down or completely inhibit deposition of the alloying element in a certain range of potentials. In this paper, we present the recent developments for SnBi and SnCu plating chemistries. The plating electrochemistry and materials properties of deposited alloys are discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0020-2967
1745-9192
DOI:10.1080/00202967.2002.11871468