Thermal Management and Electromagnetic Analysis for GaN Devices Packaging on DBC Substrate

Printed circuit boards (PCBs) are often used to mount gallium nitride transistors, as they offer good electrical performance. However, their thermal conductivity is not as good as with ceramic substrates. In this letter, we compare (experimentally and by simulation) both the electrical and thermal p...

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Bibliographic Details
Published inIEEE transactions on power electronics Vol. 32; no. 2; pp. 906 - 910
Main Authors Chenjiang Yu, Buttay, Cyril, Laboure, Eric
Format Journal Article
LanguageEnglish
Published New York IEEE 01.02.2017
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Institute of Electrical and Electronics Engineers
Subjects
Ceramics
Circuit boards
Copper
Direct-bonded copper (DBC) substrate
Electrical resistivity
electromagnetic analysis
Engineering Sciences
Gallium nitride
gallium nitride (GaN) power device
Gallium nitrides
Printed circuits
Semiconductor devices
simulation finite-element method (FEM)
Substrates
Thermal conductivity
Thermal energy
Thermal management
Thermal resistance
Transistors
GaN power device
DBC substrate
electromagnetic analysis
simulation FEM
thermal management
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Summary:Printed circuit boards (PCBs) are often used to mount gallium nitride transistors, as they offer good electrical performance. However, their thermal conductivity is not as good as with ceramic substrates. In this letter, we compare (experimentally and by simulation) both the electrical and thermal performances of GaN transistor mounted on PCBs and ceramic substrates, and we show that with a proper layout, the ceramic substrates can offer both a very good thermal management (thermal resistance four times lower than with PCB) and suitable electrical performance (parasitic inductances of 1-2 nH).
ISSN:0885-8993
1941-0107
DOI:10.1109/TPEL.2016.2585658