Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

• Published in: Journal of alloys and compounds Vol. 461; no. 1; pp. 410 - 417
• Main Authors: Zou, Hefei, Zhu, Qingsheng, Zhang, Zhefeng
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 11.08.2008; Elsevier
• Subjects: Ag single crystal substrate; Applied sciences; Brazing. Soldering; Elasticity. Plasticity; Exact sciences and technology; Fracture; Growth kinetics; Intermetallic compounds (IMCs); Joining, thermal cutting: metallurgical aspects; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Sn–3.8Ag–0.7Cu solder; Tensile strength; Fracture; Ag single crystal substrate; Sn–3.8Ag–0.7Cu solder; Intermetallic compounds (IMCs); Growth kinetics; Tensile strength; Grain size; Intermetallic compound; Ageing; Roughness; Rupture; Transition metal; Tensile property; Single crystal; Tin base alloys; Solder; Sn-3.8Ag-0.7Cu solder; Silver; Soldered joint; Kinetics; Interface reaction; Intermetallic compounds (IMCS); Diffusion coefficient; Microstructure
• ISSN: 0925-8388; 1873-4669
• DOI: 10.1016/j.jallcom.2007.07.001

The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn–3.8Ag–0.7Cu (SAC) solder joint were investigated by solid-state aging at 170 °C and liquid-state aging at 250 °C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50 × 10 −17 m 2 s −1 and 1.60 × 10 −14 m 2 s −1, respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn–Ag–Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed.