Model for Interpretation and Correlation of Contact Angle Measurements

An improved formulation relating the contact angle to the surface coverage is presented and verified. The Ohmiet al.data (Particle Sci. Technol.7,229, 1993) for ultracleaning of wafer surfaces are analyzed and correlated mathematically. It is shown that the new formulation represents the Ohmiet al.a...

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Bibliographic Details
Published inJournal of colloid and interface science Vol. 192; no. 2; pp. 500 - 502
Main Author Civan, Faruk
Format Journal Article
LanguageEnglish
Published San Diego, CA Elsevier Inc 15.08.1997
Elsevier
Subjects
Chemistry
contact angle
correlation
Exact sciences and technology
General and physical chemistry
modeling
Solid-liquid interface
surface cleaning
Surface physical chemistry
contact angle
modeling
surface cleaning
correlation
Surface cleaning
Theoretical study
Models
Contact angle
Wafer
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Summary:An improved formulation relating the contact angle to the surface coverage is presented and verified. The Ohmiet al.data (Particle Sci. Technol.7,229, 1993) for ultracleaning of wafer surfaces are analyzed and correlated mathematically. It is shown that the new formulation represents the Ohmiet al.and Engländeret al.(J. Colloid Interface Sci.179,635, 1996) data satisfactorily. In addition, the present study provides some insight into the mechanism of the variation of the surface coverage and the contact angle.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0021-9797
1095-7103
DOI:10.1006/jcis.1997.4991