Site-selective metallization of polymeric substrates by the hyperbranched polymer templates

• Published in: Applied surface science Vol. 280; pp. 164 - 170
• Main Authors: Li, Peiyuan, Yang, Fang, Li, Xiangcheng, He, Chunling, Su, Wei, Chen, Jinhao, Huo, Lini, Chen, Rui, Lu, Chensheng, Liang, Lifang
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.09.2013; Elsevier
• Subjects: Adhesive strength; Circuits; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Copper; Cross-disciplinary physics: materials science; rheology; Electronics; Exact sciences and technology; Flexible polymer; Interlayers; Metallizing; Nanoparticles; Physics; Surface modification; Transmission electron microscopy; X-ray photoelectron spectroscopy; Nanoparticles; Surface modification; Copper; Flexible polymer; Transition elements; Metallizing; Surface treatments; Polymers
• ISSN: 0169-4332; 1873-5584
• DOI: 10.1016/j.apsusc.2013.04.117

•A novel convenient method for electroless copper deposition on flexible polymer based on amine polymer is reported.•The formation of modified-substrate is characterized by ATR FT-IR and CA analysis.•The formation of Pd-activated substrate is confirmed by XPS and SEM analysis.•The copper film on substrate is characterized by SEM, TEM, CA and XRD analysis. We demonstrate a simple, cost-effective and universal technique for the fabrication of copper circuit pattern on flexible polymeric substrate. This method relies on a ternary polyethylenimine-poly(acrylic acid)-substrate film incorporating palladium catalysts, which are used as adhesive interlayers for the copper metallization of flexible polymeric substrates. We demonstrated the fabrication of patterned copper films on a variety of flexible polymers with minimum feature sizes of 200μm. And the resulting copper circuit showed strong adhesion with underlying flexible polymeric substrates. The films were characterized by ATR FT-IR, contact angle, XPS, XRD, TEM and SEM. The direct patterning of metallic circuit on flexible polymeric substrate indicates great potential for the use in electronics industry.