Accurate depth profiling of dry oxidized SiGeC thin films by extended Full Spectrum ToF-SIMS
► Oxidation of SiGeC blanket layers for Ge enrichment is studied with ToF-SIMS. ► An original quantification protocol, the extended Full Spectrum protocol, is used. ► Improvements brought by this protocol over more classic ones are highlighted. ► This study yields useful information for comprehensio...
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Published in | Applied surface science Vol. 257; no. 22; pp. 9414 - 9419 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.09.2011
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | ► Oxidation of SiGeC blanket layers for Ge enrichment is studied with ToF-SIMS. ► An original quantification protocol, the extended Full Spectrum protocol, is used. ► Improvements brought by this protocol over more classic ones are highlighted. ► This study yields useful information for comprehension of the oxidation mechanisms.
The abundance of work on SiGe based devices demonstrates the importance of compositional characterization of such materials. However accurate SIMS depth profiling of SiGe, and especially of SiGe/silicon dioxide interfaces can be difficult due to matrix effects.
Therefore, we highlight here the improvements brought by the extended Full Spectrum protocol, presented in previous works and allowing minimization of matrix effects. Previous studies on this protocol showed that it was extremely precise and reproducible for Ge and impurity quantification in non oxidized matrices. In this study we thus investigated its accuracy for
simultaneous quantitative depth profiling of both matrix elements (Si, Ge, O) and impurities (C) in Si
0.82Ge
0.16C
0.02 layers annealed in oxidizing atmosphere, by comparing results with more classic protocols. The profiles provided by the extended Full Spectrum protocol were found to be more accurate than the others, especially around interfaces. This results in a better comprehension of the behaviour of SiGeC layers under oxidizing anneal and thus allows the fabrication of very well controlled three dimensional Ge nanowire structures for next generation devices. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2011.06.021 |