Designing and Modeling for Power Integrity

After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via dis...

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Published inIEEE transactions on electromagnetic compatibility Vol. 52; no. 2; pp. 288 - 310
Main Authors Swaminathan, Madhavan, Daehyun Chung, Grivet-Talocia, Stefano, Bharath, Krishna, Laddha, Vishal, Jianyong Xie
Format Journal Article
LanguageEnglish
Published New York IEEE 01.05.2010
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Boards
Capacitors
Discontinuity
Driver circuits
Electromagnetic compatibility
Impedance
Insertion loss
Macro-modeling
Mathematical models
Microstrip
Noise
Packages
passivity
Power distribution
power integrity
Printed circuits
return path discontinuity
signal integrity
Switches
Waveforms
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Summary:After providing an overview of the state-of-the-art in power distribution design and modeling, this paper focuses on return path discontinuities (RPDs) for I/O signaling. After briefly describing their importance in the context of simultaneous switching noise, a specific case of RPD based on via discontinuities is discussed in detail in the context of both the frequency- and time-domain waveforms using a test vehicle. The modeling of RPD in practical packages and printed circuit boards is addressed along with substrate coupling due to nonideal reference planes. Finally, a high-impedance power distribution scheme for I/O signaling is presented that can potentially solve a number of RPD-related problems, followed by future challenges.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2010.2045382