Evaluating the effects of Zn(II) on high-rate biogranule-based denitrification: Performance, microbial community and sludge characteristics
[Display omitted] •The suppression threshold of Zn(II) on reactor performance was 10 mg L−1 for long-term exposure.•Castellaniella mainly was devoted to denitrification under no or low Zn(II) stress conditions.•Klebsiella was the dominant denitrifying bacteria under high Zn(II) stress conditions. Hi...
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Published in | Bioresource technology Vol. 279; pp. 393 - 397 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
England
Elsevier Ltd
01.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | [Display omitted]
•The suppression threshold of Zn(II) on reactor performance was 10 mg L−1 for long-term exposure.•Castellaniella mainly was devoted to denitrification under no or low Zn(II) stress conditions.•Klebsiella was the dominant denitrifying bacteria under high Zn(II) stress conditions.
High-rate denitrification is a popular and efficient process for treatment of nitrate-rich wastewater. Knowing the effect of heavy metals on denitrification is essential for industrial development. In the present study, the long-term impacts of Zn(II) on denitrifying granular sludge were investigated. The suppression threshold of Zn(II) on denitrifying bacteria was 10 mg L−1 for long-term exposure. The nitrogen removal rate was decreased by long-term addition of 10 mg L−1 Zn(II). Castellaniella and Klebsiella were the two dominant genera under Zn(II) stress. The relative abundance of Klebsiella sharply decreased to 4.64% after the addition of 10 mg L−1 Zn(II), whereas Castellaniella was susceptible to 2 mg L−1 Zn(II), revealing that Castellaniella mainly was devoted to denitrification under no or low Zn(II) stress conditions, whereas Klebsiella was effective under high Zn(II) stress. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0960-8524 1873-2976 |
DOI: | 10.1016/j.biortech.2019.02.005 |