Anchoring of alkylphosphonic derivatives molecules on copper oxide surfaces

[Display omitted] ► A new approach for copper surface functionalization using phosphonic acid molecules and derivative. ► Results revealed the efficient grafting, the organization as well as the grafting mode of molecules on the copper surface. ► This opens a new range of applications in the area of...

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Published inApplied surface science Vol. 257; no. 14; pp. 6300 - 6307
Main Authors Fonder, Grégory, Minet, Isabelle, Volcke, Cédric, Devillers, Sébastien, Delhalle, Joseph, Mekhalif, Zineb
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.05.2011
Elsevier
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Summary:[Display omitted] ► A new approach for copper surface functionalization using phosphonic acid molecules and derivative. ► Results revealed the efficient grafting, the organization as well as the grafting mode of molecules on the copper surface. ► This opens a new range of applications in the area of oxide surface and interface science and technology. In this study, a new approach of copper surface modification, taking advantage of the oxide layer naturally present, is proposed using phosphonic acids derivatives. Phosphonic acids are a class of molecules particularly known for their spontaneous self-assembly on oxidized substrates. On this basis, copper substrates chemically oxidized using H 2O 2 (5%) were successfully modified with n-dodecylphosphonic acid and 1-pyrrolyl-10-decanephosphonic acids. The oxidation state of copper substrate, just after chemical oxidation, was probed by XPS and PM-IRRAS. Surface characterization was completed by contact angle and AFM measurements. Molecular integrity, alkyl chain ordering and wettability were evaluated for both elaborated coatings. The panel of characterization tools used demonstrates the efficient grafting of phosphonic acid compounds on oxidized copper surfaces. The grafting mode appears similar for both investigated molecules and is evaluated as a tridentate mode.
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ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2011.02.071