Diffusion bonding of superplastic 7075 aluminium alloy

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 266; no. 1; pp. 295 - 302
• Main Authors: Huang, Y, Ridley, N, Humphreys, F.J, Cui, J.-Z
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 30.06.1999; Elsevier
• Subjects: Applied sciences; Bonding; Cross-disciplinary physics: materials science; rheology; Deformation, plasticity, and creep; Diffusion; Exact sciences and technology; Materials science; Metals. Metallurgy; Physics; Superplastic; Treatment of materials and its effects on microstructure and properties; Diffusion; Bonding; Superplastic; Grain boundaries; Superplasticity; Aluminium base alloys; Shear; Grain growth; Magnesium alloys; Shear strength; Grain boundary migration; Chromium alloys; Experimental study; Zinc alloys; Protective layer; Copper alloys; Manganese alloys; Microstructure; Transition element alloys
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/S0921-5093(98)00958-7

Diffusion bonding (DB) of superplastic 7075 Al alloy has been investigated for various temperatures, pressures and times, using a Gleeble 1500 test machine. After the removal of surface oxide, an organic solution was used to protect the surfaces prior to bonding. The strengths achieved after bonding were dependent on interface grain boundary migration and on grain growth during the bonding process. Under optimum conditions, bonds having parent metal shear strength and microstructure were obtained. The optimum temperatures for diffusion bonding, 510–520°C, corresponded with those at which the material exhibited optimum superplastic behavior. The characteristics and mechanisms of bonding are discussed.