In-situ ellipsometric study of copper passivation by copper heptanoate through electrochemical oxidation

Inhibition of copper in a desearated sodium heptanoate solution (0.08 M, pH 8.0) by electro-oxidation has been investigated. R p measurements were carried out to compare inhibition efficiency using this original method with that based on other usual chemical oxidation methods. In-situ spectroscopic...

Full description

Saved in:
Bibliographic Details
Published inElectrochimica acta Vol. 43; no. 21; pp. 3227 - 3234
Main Authors Stein, N., Johann, L., Rapin, C., Lecuire, J.M.
Format Journal Article
LanguageEnglish
Published Oxford Elsevier Ltd 01.01.1998
Elsevier
Subjects
Applied sciences
copper II heptanoate
copper inhibition
Corrosion
Corrosion environments
Exact sciences and technology
in-situ ellipsometry
Metals. Metallurgy
passivation
passivation
copper inhibition
in-situ ellipsometry
copper II heptanoate
Corrosion resistance
Protective layer
Growth
Oxidation
Copper
Corrosion protection
Layer thickness
Velocity
Corrosion inhibitor
Ellipsometry
Passivation
Online AccessGet full text

Cover

More Information
Summary:Inhibition of copper in a desearated sodium heptanoate solution (0.08 M, pH 8.0) by electro-oxidation has been investigated. R p measurements were carried out to compare inhibition efficiency using this original method with that based on other usual chemical oxidation methods. In-situ spectroscopic and kinetic ellipsometric measurements have been performed to study the passivation mechanism of copper. The inhibition of copper is attributed to the formation of a protective layer composed of a mixture of copper II heptanoate and copper hydroxide. Two growth rates are observed during the passivation process. A model of a duplex layer is proposed. The thickness of the passive film is evaluated at 14±1.5 nm.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0013-4686
1873-3859
DOI:10.1016/S0013-4686(98)00053-X