Transparent conducting films of silver hybrid films formed by near-field electrospinning

• Published in: Materials letters Vol. 185; pp. 139 - 142
• Main Authors: Youn, Doo-Hyeb, Yu, Young-Jun, Choi, Jin Sik, Park, Nae-Man, Yun, Sun Jin, Lee, Inyeal, Kim, Gil-Ho
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 15.12.2016; Elsevier BV
• Subjects: Electrical resistivity; Electrodes; Electrospinning; Hybrid structures; Low resistance; Low-resistance conducting film; Materials science; Mesh electrode; Nanoparticles; Nanowires; Near-field electrospinning; Nozzles; Patterning; Photovoltaic cells; Plates (structural members); Semiconductors; Silver; Silver nanowire; Solar cells; Substrates; Transmittance; NP; NFES; Low-resistance conducting film; Ag; NW; Silver nanowire; Mesh electrode; Near-field electrospinning
• ISSN: 0167-577X; 1873-4979
• DOI: 10.1016/j.matlet.2016.08.128

Transparent conducting films (TCFs) are critical in the implementation of the low resistance TCFs of <30Ω/square at the transmittance of >90% for the realization of commercial devices such as LEDs and solar cells. We fabricate the hybrid structures of the spin-coated silver nanowire film and the electro-spun silver nanoparticle mesh in order to reduce the sheet resistance of TCFs at high transmittance. After the patterning of the electro-spun Ag NP mesh, the Ag NW solution was spin-coated on the top of the electro-spun mesh pattern. The Ag NP mesh functioned as a backbone to connect the electrically non-connected spaces between the Ag NWs. The fabrication of TCFs on an insulating substrate by near-field electrospinning (NFES) is very difficult because the insulating substrate blocks the electric field between the nozzle and collecting plate during electrospinning. We successfully fabricated the low-resistance microscale electrodes with a line width narrower than 100µm using NFES on an insulating substrate. In this study, we use a NFES as a tool for the easy and fast fabrication of microscale mesh electrodes without costly process steps. •Low resistance and high transparent films simultaneously obtained.•Ag mesh used as a backbone to electrically connect open spaces between Ag NWs.•NFES is proposed as a fabrication tool of Ag mesh on insulating substrate.•To fabricated fine electrodes on insulating substrate microscale is very difficult.•We use with the guiding-ring structure to confine the laterally disturbed cone-jet mode.