Residual stress analysis of deuterium irradiated copper coatings

• Published in: Scripta materialia Vol. 43; no. 8; pp. 711 - 717
• Main Authors: Battal, T, Inal, O.T, Rangaswamy, P
• Format: Journal Article
• Language: English
• Published: New York, NY Elsevier Ltd 29.09.2000; Elsevier Science
• Subjects: Applied sciences; Condensed matter: structure, mechanical and thermal properties; Deuterium; Exact sciences and technology; Mechanical and acoustical properties; Metals. Metallurgy; Physical properties of thin films, nonelectronic; Physics; Plasma deposition; Residual stress; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); X-ray diffraction; Deuterium; X-ray diffraction; Plasma deposition; Residual stress; Radiation effects; Stress analysis; Physical vapor deposition; Irradiation; Residual stresses; XRD; Copper; Experimental study; Coatings
• ISSN: 1359-6462; 1872-8456
• DOI: 10.1016/S1359-6462(00)00472-3

A novel technique, based on plasma assisted physical vapor deposition, was utilized for coating of pure copper on aluminum 6061 substrates. These coated specimens were then deuterium irradiated. Finally, residual stress measurements were determined for both pre-irradiated and post-irradiated samples using x-ray diffraction. The pre-irradiation samples for each set repeatedly revealed compressive residual stresses. Significant decrease in compressive stresses was experienced after the irradiation for each set of coatings. It is clear that further, detailed, systematic studies are required to examine the irradiation effect on the residual stresses for the Cu coatings and developing an understanding of all the possible mechanisms that contribute to the observed stress relaxation.