Growth of TiN films at low temperature

• Published in: Applied surface science Vol. 253; no. 17; pp. 7019 - 7023
• Main Authors: Wei, L.I., Jun-Fang, Chen
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 30.06.2007; Elsevier Science
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Driving force; Exact sciences and technology; Fractal dimension; Physics; Temperature of deposition; Titanium nitride (TiN); 47.54.Jk; Driving force; Titanium nitride (TiN); Temperature of deposition; Fractal dimension; 68.65.−k; Inorganic compounds; Transition element compounds; 68.65.-k; Titanium nitrides
• ISSN: 0169-4332; 1873-5584
• DOI: 10.1016/j.apsusc.2007.02.028

Thermodynamic analysis on growth of TiN films was given. The driving force for deposition of TiN is dependent on original Ti(g)/N(g) ratio and original partial pressure of N(g). TiN films were deposited by ion beam assisted electron beam evaporation system under suitable nitrogen gas flow rate at 523 K while the density of plasma varied with diverse discharge pressure had been investigated by the Langmuir probe. TiN films were characterized by means of Fourier transform infrared absorption spectrum (FTIR), X-ray diffraction (XRD) and observed by means of atom force microscopy (AFM). The results of these measurements indicated preferential TiN(1 1 1) films were deposited on substrate of Si(1 0 0) and glass by ion beam assisted electron beam evaporation system at low temperature, and it was possible for the deposition of TiN films with a preferential orientation or more orientations if the nitrogen gas flow rate increased enough. Sand Box was used to characterize the fractal dimension of surface of TiN films. The results showed the fractal dimension was a little more than 1.7, which accorded with the model of diffusion limited aggregation (DLA), and the fractal dimension of TiN films increased with increase of the temperature of deposition.