Fabrication and performance of bottom-emitting flip-chip bonded 980 nm vertical-cavity lasers with copper- and indium-plated heat-sinks
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Published in | Semiconductor science and technology Vol. 26; no. 12; p. 125020 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Bristol
IOP Publishing
07.12.2011
Institute of Physics |
Subjects | |
Online Access | Get full text |
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ISSN: | 0268-1242 1361-6641 |
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DOI: | 10.1088/0268-1242/26/12/125020 |