Polarity dependent Al–Ti contacts to 6H–SiC

In this paper, an Al–Ti contact preparation method is described on 6H–SiC wafers. The Al and Ti were both separately deposited and co-deposited onto Si→C polarized ( 0 0 0 1 ̄ ) C and C→Si polarized (0 0 0 1) Si faces of SiC substrate by dc magnetron sputtering. The samples were annealed at 1000 °C...

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Bibliographic Details
Published inApplied surface science Vol. 233; no. 1; pp. 360 - 365
Main Authors Veisz, Bernadett, Pécz, Béla
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 30.06.2004
Elsevier Science
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Summary:In this paper, an Al–Ti contact preparation method is described on 6H–SiC wafers. The Al and Ti were both separately deposited and co-deposited onto Si→C polarized ( 0 0 0 1 ̄ ) C and C→Si polarized (0 0 0 1) Si faces of SiC substrate by dc magnetron sputtering. The samples were annealed at 1000 °C in N 2 atmosphere. The phase and morphology of the formed contacts were investigated by transmission electron microscopy. The formed contacts clearly showed polarity dependence on SiC substrate. When the SiC substrate was Si→C polarized the binary Al 3Ti phase generated. When it was C→Si polarized the ternary Ti 3SiC 2 formed along with the Al 3Ti resulting in a bilayered contact structure.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2004.03.253