Mechanical properties of epoxy composites with low content of diamond particles

• Published in: Journal of applied polymer science Vol. 127; no. 5; pp. 4079 - 4085
• Main Authors: Rakha, Sobia A., Khan, Ramsha R., Khurram, Aqeel A., Fayyaz, A., Zakaullah, M., Munir, Arshad
• Format: Journal Article
• Language: English
• Published: Hoboken Wiley Subscription Services, Inc., A Wiley Company 05.03.2013; Wiley; Wiley Subscription Services, Inc
• Subjects: Applied sciences; Composites; dispersions; Exact sciences and technology; fillers; Forms of application and semi-finished materials; hardness; Materials science; mechanical properties; Polymer industry, paints, wood; Polymers; spectroscopy; Technology of polymers; Strengthening; Vickers hardness; Synthetic diamond; Epoxy resin; Mechanical properties; Dispersion reinforced material; Experimental study; Composite material; Surface treatment; fillers; hardness; Dynamic mechanical properties; dispersions; spectroscopy; Concentration effect
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.38029

Diamond‐epoxy composites reinforced with low content of submicron diamond powder 0.1, 0.4, 0.7, and 1.0 wt % were synthesized. As received diamond powder was acid treated to purify and functionalize diamond particles. Fourier Transform Infrared Spectroscopy was utilized to study the moieties attached to the diamond particles. The trace elemental analysis of impurities in diamond powder before and after acid treatment was performed using ion beam techniques. The mechanical properties of the epoxy matrix were enhanced with the addition of purified and functionalized diamond powder. The Dynamical mechanical analysis results revealed that storage modulus of the prepared composites has been increased by ∼ 100% with diamond loading of 0.7 wt %. The Vickers's hardness of the diamond‐epoxy composite was ∼ 39% higher than that of pure epoxy for the loading of 1.0 wt % diamond powder. Mechanisms responsible for the enhancement of the mechanical properties are discussed. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013