Elastic modulus of and residual stresses in diamond films

• Published in: Thin solid films Vol. 260; no. 1; pp. 118 - 123
• Main Authors: Chiu, Chin-Chen, Liou, Yung, Yung-Der, Juang
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 01.05.1995; Elsevier Science
• Subjects: Coatings; Condensed matter: structure, mechanical and thermal properties; Diamond; Elastic properties; Exact sciences and technology; Mechanical and acoustical properties; Physical properties of thin films, nonelectronic; Physics; Stress; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Diamond; Elastic properties; Coatings; Stress; CVD; Thin films; Young modulus; Raman spectra; Diamonds; Mechanical properties; Residual stresses
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/0040-6090(94)06457-1

Diamond thin films were prepared using microwave-enhanced chemical vapor deposition techniques with different concentration ratios of CH4 to H2 at temperatures of 800 °C and 900 °C. The elastic modulus of the films varies non-linearly with the change in the ratio of CH4 to H2, and is not significantly affected by changes in the process temperature. Compressive and tensile residual stresses develop in the films prepared at 800 °C and 900 °C, respectively. The magnitude of the stresses is a function of the CH4H2 ratio. An analysis of Raman spectra reveals that the quality of the films is influenced by the CH4H2 ratio.