The effect of mechanical constraint on the flow and fracture of 63/37 Sn/Pb eutectic alloy

• Published in: Engineering fracture mechanics Vol. 52; no. 4; pp. 647 - 669
• Main Authors: Skipor, A.F., Harren, S.V., Botsis, J.
• Format: Journal Article
• Language: English
• Published: Tarrytown, NY Elsevier Ltd 01.11.1995; Oxford Elsevier
• Subjects: Applied sciences; Exact sciences and technology; Fractures; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Eutectic alloy; Tin alloy; Electronic circuit; Numerical method; Experimental study; Automatic mesh generation; Mechanical test; Finite element method; Solder; Compact tension test; Lead alloy; Viscoplasticity; Binary alloy
• ISSN: 0013-7944; 1873-7315
• DOI: 10.1016/0013-7944(95)00035-T

Copper compact tension specimens containing joints of 63/37 Sn/Pb eutectic solder alloy are used to study experimentally the flow and fracture behavior of eutectic solder under conditions of monotonic loading and mechanical constraint. Such constraint arises naturally due to the presence of the specimens' copper/solder interfaces, and various levels of constraint are achieved by employing joints of various sizes. Concomitant finite element analyses of the compact tension experiments are performed in which the solder is characterized by the phenomenological viscoplasticity model of Bodner and Partom. These experimental and analytical results, along with electron microscopy of the failure surfaces, clearly demonstrate the interplay between plastic flow, mechanical constraint, and microscopic characteristics of copper,/solder interfaces, in the overall response of, and failure initiation in, these composite specimens.