An Auger microscopy study of the meeting and interdiffusion of pure Pb and Bi adsorbed layers on polycrystalline Cu

The spreading of Pb and Bi adsorbed layers from pure bulk sources, and their intermixing, on a Cu substrate, has been studied by scanning Auger microscopy at 473 K. The pure Pb layer spreads faster than the Bi layer. When the pure layers meet, two phenomena are observed. The junction line of the two...

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Bibliographic Details
Published inSurface science Vol. 575; no. 1; pp. 69 - 74
Main Authors Monchoux, J.P., Chatain, D., Wynblatt, P.
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 01.01.2005
Amsterdam Elsevier Science
New York, NY Elsevier
Subjects
Auger electron spectroscopy
Bismuth
Chemical Sciences
Condensed Matter
Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
Copper
Cristallography
Cross-disciplinary physics: materials science; rheology
Exact sciences and technology
Lead
Material chemistry
Physics
Surface diffusion
Lead
Bismuth
Auger electron spectroscopy
Surface diffusion
Copper
Scanning Auger microscopy
Adsorbed layers
Transition elements
Interdiffusion
Auger microscopy
Bilayers
AES
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Summary:The spreading of Pb and Bi adsorbed layers from pure bulk sources, and their intermixing, on a Cu substrate, has been studied by scanning Auger microscopy at 473 K. The pure Pb layer spreads faster than the Bi layer. When the pure layers meet, two phenomena are observed. The junction line of the two adsorbed layers drifts due to a replacement of adsorbed Pb by Bi. Superimposed on this drift, the Pb and Bi layers undergo interdiffusion. The interdiffusion coefficient has been analyzed by the Boltzmann–Matano method.
ISSN:0039-6028
1879-2758
DOI:10.1016/j.susc.2004.11.004