Infrared steam laser cleaning

Steam Laser Cleaning with a pulsed infrared laser source is investigated. The infrared light is tuned to the absorption maximum of water ( λ =2.94 μm, 10 ns), whereas the substrates used are transparent (glass, silicon). Thus a thin liquid water layer condensed on top of the contaminated substrate i...

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Bibliographic Details
Published inApplied physics. A, Materials science & processing Vol. 93; no. 1; pp. 1 - 4
Main Authors Frank, P., Lang, F., Mosbacher, M., Boneberg, J., Leiderer, P.
Format Journal Article
LanguageEnglish
Published Berlin/Heidelberg Springer-Verlag 01.10.2008
Subjects
Adhesion
Characterization and Evaluation of Materials
Cleaning
Condensed Matter Physics
Explosions
Infrared
Lasers
Liquids
Machines
Manufacturing
Nanotechnology
Optical and Electronic Materials
Physics
Physics and Astronomy
Processes
Silicon substrates
Surfaces and Interfaces
Thin Films
68.43.Vx
81.65.Cf
64.70.F
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Summary:Steam Laser Cleaning with a pulsed infrared laser source is investigated. The infrared light is tuned to the absorption maximum of water ( λ =2.94 μm, 10 ns), whereas the substrates used are transparent (glass, silicon). Thus a thin liquid water layer condensed on top of the contaminated substrate is rapidly heated. The pressure generated during the subsequent phase explosion generates a cleaning force which exceeds the adhesion of the particles. We examine the cleaning threshold in single shot experiments for particles sized from 1 μm down to 300 nm.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0947-8396
1432-0630
DOI:10.1007/s00339-008-4651-7