High temperature performance of composite adhesives based on PEEK and boron carbide particles

In the present work, poly(ether ether ketone) (PEEK) composites reinforced with increasing amount of particles of boron carbide (B4C) were developed and characterized for thermal, mechanical, and high‐temperature adhesive properties. The inclusion of B4C particles led to decrease in crystallization...

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Bibliographic Details
Published inPolymer composites Vol. 40; no. 6; pp. 2473 - 2481
Main Authors Kumar, Kadiyala Ajay, Bijwe, Jayashree, Kalappa, Prashantha
Format Journal Article
LanguageEnglish
Published Hoboken, USA John Wiley & Sons, Inc 01.06.2019
Blackwell Publishing Ltd
Wiley
Subjects
Adhesive strength
Armor
Boron carbide
Crystallization
Engineering Sciences
Fracture mechanics
High temperature
Particulate composites
Polyether ether ketones
Polymer matrix composites
Polymers
Scanning electron microscopy
Stability analysis
Temperature
Thermal stability
Thermogravimetric analysis
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Summary:In the present work, poly(ether ether ketone) (PEEK) composites reinforced with increasing amount of particles of boron carbide (B4C) were developed and characterized for thermal, mechanical, and high‐temperature adhesive properties. The inclusion of B4C particles led to decrease in crystallization temperature (Tc) and a slight increase in % crystallinity. Thermogravimetric analysis (TGA) revealed an increase in thermal stability due to the B4C particles. The adhesive strength of composites showed improvement as compared to virgin PEEK apart from better retention of strength at higher temperatures. 20 wt% of B4C particles was found to be the optimum amount for highest adhesion at high temperatures in the developed series. Fracture analysis was carried out using scanning electron microscopy (SEM). POLYM. COMPOS., 40:2473–2481, 2019. © 2018 Society of Plastics Engineers
ISSN:0272-8397
1548-0569
DOI:10.1002/pc.25124