Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method

With the development of microelectronics towards integration, miniaturization and high power, the accumulation of heat in this small space has become a serious problem. Therefore, polymer matrix composites with high thermal conductivity and electrical insulation need to be developed urgently. Here,...

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Bibliographic Details
Published inJournal of materials science. Materials in electronics Vol. 35; no. 15; p. 1032
Main Authors Wu, Zijian, Gao, Shunying, Wang, Xuefei, Ibrahim, Mohamed M., Mersal, Gaber A. M., Ren, Juanna, El-Bahy, Zeinhom M., Guo, Ning, Gao, Junguo, Weng, Ling, Guo, Zhanhu
Format Journal Article
LanguageEnglish
Published New York Springer US 01.05.2024
Springer Nature B.V
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