Dielectric thermally conductive boron nitride/silica@MWCNTs/polyvinylidene fluoride composites via a combined electrospinning and hot press method
With the development of microelectronics towards integration, miniaturization and high power, the accumulation of heat in this small space has become a serious problem. Therefore, polymer matrix composites with high thermal conductivity and electrical insulation need to be developed urgently. Here,...
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Published in | Journal of materials science. Materials in electronics Vol. 35; no. 15; p. 1032 |
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Main Authors | , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
Springer US
01.05.2024
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
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