VPIC 2.0: Next Generation Particle-in-Cell Simulations
VPIC is a general purpose particle-in-cell simulation code for modeling plasma phenomena such as magnetic reconnection, fusion, solar weather, and laser-plasma interaction in three dimensions using large numbers of particles. VPIC's capacity in both fidelity and scale makes it particularly well...
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Published in | IEEE transactions on parallel and distributed systems Vol. 33; no. 4; pp. 952 - 963 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.04.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Institute of Electrical and Electronics Engineers |
Subjects | |
Online Access | Get full text |
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Summary: | VPIC is a general purpose particle-in-cell simulation code for modeling plasma phenomena such as magnetic reconnection, fusion, solar weather, and laser-plasma interaction in three dimensions using large numbers of particles. VPIC's capacity in both fidelity and scale makes it particularly well-suited for plasma research on pre-exascale and exascale platforms. In this article, we demonstrate the unique challenges involved in preparing the VPIC code for operation at exascale, outlining important optimizations to make VPIC efficient on accelerators. Specifically, we show the work undertaken in adapting VPIC to exploit the portability-enabling framework Kokkos and highlight the enhancements to VPIC's modeling capabilities to achieve performance at exascale. We assess the achieved performance-portability trade-off through a suite of studies on nine different varieties of modern pre-exascale hardware. Our performance-portability study includes weak-scaling runs on three of the top ten TOP500 supercomputers, as well as a comparison of low-level system performance of hardware from four different vendors. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 USDOE USDOE Office of Science (SC). Advanced Scientific Computing Research (ASCR) IBM LA-UR-21-21453; 89233218CNA000001; 578735; 1927880 LA-UR-21-23798; LA-UR-21-21453 |
ISSN: | 1045-9219 1558-2183 |
DOI: | 10.1109/TPDS.2021.3084795 |