Mechanical properties and residual stresses changing on 00Cr12 alloy by nanoseconds laser shock processing at high temperatures

[Display omitted] ▶ LSP introduces a compressive residual stress filed up to −382 MPa. ▶ The residual compressive stress will be relaxed under high temperature. ▶ LSP successfully enhances the yield strength and tensile strength. ▶ LSP has the greatest effect on the 00Cr12 at less than 600 °C. Effec...

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Published inMaterials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 528; no. 4; pp. 1949 - 1953
Main Authors Ren, X.D., Zhang, T., Zhang, Y.K., Jiang, D.W., Yongzhuo, H.F., Guan, H.B., Qian, X.M.
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier B.V 25.02.2011
Elsevier
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Summary:[Display omitted] ▶ LSP introduces a compressive residual stress filed up to −382 MPa. ▶ The residual compressive stress will be relaxed under high temperature. ▶ LSP successfully enhances the yield strength and tensile strength. ▶ LSP has the greatest effect on the 00Cr12 at less than 600 °C. Effects of laser shock processing (LSP) on 00Cr12 alloy's mechanical properties at high temperatures were analyzed by investigating the changing of the residual stress and tensile properties. The results showed that the compressive residual stress produced by LSP, which makes the 00Cr12 alloy's yield strength and tensile strength increase, still played an important role in the high temperature tensile test. The tensile fracture showed that the break position and expand direction were changed because of the residual compressive stress existing, and the residual compressive stress was greatly released with the increasing temperature. The results demonstrated that the cycle, stress amplitude and temperature-dependent relaxation of compressive residual stresses were more pronounced than the decrease of near-surface work strengthening.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2010.10.098