Wafer level reliability and leakage current modeling of PZT capacitors

• Published in: Materials science & engineering. B, Solid-state materials for advanced technology Vol. 118; no. 1; pp. 28 - 33
• Main Authors: Bouyssou, E., Jérisian, R., Cézac, N., Leduc, P., Guégan, G., Anceau, C.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 25.04.2005
• Subjects: Constant voltage stress; Electrical properties; PbZr xTi 1− xO 3; Electrical properties; Constant voltage stress; PbZr x Ti 1− x O 3
• ISSN: 0921-5107; 1873-4944
• DOI: 10.1016/j.mseb.2004.12.056

Over the last few years, thin films of PbZr x Ti 1− x O 3 (PZT) have been the focus of extensive researches for high-k capacitor applications. However, some electrical properties such as leakage current conduction and degradation mechanisms need to be better understood. From Constant Voltage Stress experiments, we identified two distinct failure mechanisms depending on the applied voltage levels. The existence of these two failure mechanisms makes it impossible to extrapolate lifetime results from high voltage to low voltage. Since the typical operating voltage for decoupling capacitors is around 3 V the reliability study has to be focused on the low voltage breakdown. A good opportunity to learn about the low voltage failure mechanisms is to investigate the characteristics of leakage current. The time evolution of leakage current is mainly controlled by the resistance degradation phenomenon. A quantitative analytical model has already been developed to account for this effect. We propose a more complete model that also includes dielectric relaxation and trapping effects. The resulting model is combined to a charge-influenced thermoionic emission model that fits fairly well the voltage and temperature dependence of leakage current. The static and dynamic parts of our model are found to be consistent, especially in terms of barrier lowering effect induced by the resistance degradation process. We believe that the low voltage breakdown is related to a trapping-induced creation of defects in the film.