Investigation of lanthanum and hafnium-based dielectric films by X-ray reflectivity, spectroscopic ellipsometry and X-ray photoelectron spectroscopy
LaAlO 3 and HfAl x O y thin films have been deposited by magnetron sputtering for replacement of SiO 2 in new Complementary Metal Oxide Semiconductor applications. A three-layer model was found both in X-ray reflectivity (XRR) and spectroscopic ellipsometry (SE) analysis to be the best optical model...
Saved in:
Published in | Thin solid films Vol. 516; no. 22; pp. 7974 - 7978 |
---|---|
Main Authors | , , , , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Lausanne
Elsevier B.V
30.09.2008
Elsevier Science Elsevier |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | LaAlO
3 and HfAl
x
O
y
thin films have been deposited by magnetron sputtering for replacement of SiO
2 in new Complementary Metal Oxide Semiconductor applications. A three-layer model was found both in X-ray reflectivity (XRR) and spectroscopic ellipsometry (SE) analysis to be the best optical model for these two high-κ materials. It was composed of an interfacial layer, covered by a layer of pure LaAlO
3 or HfAl
x
O
y
, and a surface-roughness layer. In the case of LaAlO
3 and HfAl
x
O
y
directly deposited on Si, the interfacial layer is a mixture of high-k material and amorphous-Si inclusions, which thickness is growing after post-deposition annealing (PDA) in O
2 at 600 °C. On the contrary, for films deposited on thermally nitrided Si, the SiON-like interface did not change significantly after a PDA in O
2. XRR analysis showed that the dielectric/Si interface of HfAl
x
O
y
/SiON/Si structure had a significantly smaller roughness than those of HfAl
x
O
y
/Si. When being deposited on SiON/Si substrates, HfAl
x
O
y
, and to a lesser extent LaAlO
3, demonstrate superior diffusion barrier properties pointed out by X-ray photoelectron spectroscopy. |
---|---|
ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2008.04.006 |