Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles
[Display omitted] •Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation.•Analysis by a FLIR camera has showed tha...
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| Published in | Materials research bulletin Vol. 110; pp. 76 - 81 |
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| Main Authors | , , , , , , , , , , , , , |
| Format | Journal Article |
| Language | English |
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Elsevier Ltd
01.02.2019
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| Abstract | [Display omitted]
•Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation.•Analysis by a FLIR camera has showed that the combination of GO and Cu NPs enabled heat dissipation properties.•The thermal resistance of the mixed GO–Cu NPs structure is less 37 % than that of the Al heat sink.
Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance was explored by creating two types of samples: spray–coated with a mixed GO–Cu NPs and layer–by–layer stacked with GO/Cu NPs/GO. A reduction of thermal resistance for mixed GO–Cu NPs and layer–by–layer stacked structure by 37% and 33%, respectively, compared to that of Al heat sink. The lower thermal resistance of the mixed GO–Cu NPs sample is attributed to the fact that distributed Cu NPs at the step edge of GO sheets enhances the out–of–plane heat transfer at wrinkles/folds of GO interlayers. Therefore, a mixed GO–Cu NPs is considered as a promising composite for effective thermal management of high–performance optoelectronic devices. |
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| AbstractList | [Display omitted]
•Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation.•Analysis by a FLIR camera has showed that the combination of GO and Cu NPs enabled heat dissipation properties.•The thermal resistance of the mixed GO–Cu NPs structure is less 37 % than that of the Al heat sink.
Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance was explored by creating two types of samples: spray–coated with a mixed GO–Cu NPs and layer–by–layer stacked with GO/Cu NPs/GO. A reduction of thermal resistance for mixed GO–Cu NPs and layer–by–layer stacked structure by 37% and 33%, respectively, compared to that of Al heat sink. The lower thermal resistance of the mixed GO–Cu NPs sample is attributed to the fact that distributed Cu NPs at the step edge of GO sheets enhances the out–of–plane heat transfer at wrinkles/folds of GO interlayers. Therefore, a mixed GO–Cu NPs is considered as a promising composite for effective thermal management of high–performance optoelectronic devices. |
| Author | Lee, Kyu-Han Ko, Kang Bok Lim, Yongsu Hong, Chang-Hee Han, Min Ryu, Jae Hyung Kim, Kyurin Thanh, Do Trong Han, Nam Park, Noh-Joon Cuong, Tran Viet Jo, Chang Hee Ryu, Beo Deul Ju, Kwanseon |
| Author_xml | – sequence: 1 givenname: Beo Deul surname: Ryu fullname: Ryu, Beo Deul organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 2 givenname: Min surname: Han fullname: Han, Min organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 3 givenname: Kang Bok surname: Ko fullname: Ko, Kang Bok organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 4 givenname: Kyu-Han surname: Lee fullname: Lee, Kyu-Han organization: LED Agri-bio Fusion Technology Research Center, Chonbuk National University, Iksan, 54596, South Korea – sequence: 5 givenname: Tran Viet surname: Cuong fullname: Cuong, Tran Viet organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 6 givenname: Nam surname: Han fullname: Han, Nam organization: Department of Material Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, South Korea – sequence: 7 givenname: Kyurin surname: Kim fullname: Kim, Kyurin organization: Korea Institute of Lighting Technology Jeonbuk Institute, Wonkwang University, Iksan, 54538, South Korea – sequence: 8 givenname: Jae Hyung surname: Ryu fullname: Ryu, Jae Hyung organization: Korea Institute of Lighting Technology Jeonbuk Institute, Wonkwang University, Iksan, 54538, South Korea – sequence: 9 givenname: Noh-Joon orcidid: 0000-0001-9224-7067 surname: Park fullname: Park, Noh-Joon organization: ALLIX Co., Ltd., Ballyong-ro 69, Deokjin-gu, Jeonju, 54853, South Korea – sequence: 10 givenname: Yongsu surname: Lim fullname: Lim, Yongsu organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 11 givenname: Do Trong surname: Thanh fullname: Thanh, Do Trong organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 12 givenname: Chang Hee surname: Jo fullname: Jo, Chang Hee organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 13 givenname: Kwanseon surname: Ju fullname: Ju, Kwanseon organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea – sequence: 14 givenname: Chang-Hee surname: Hong fullname: Hong, Chang-Hee email: chhong@jbnu.ac.kr organization: School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea |
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•Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of... |
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| SubjectTerms | Copper nanoparticles Graphene oxide Heat dissipation Thermal resistance |
| Title | Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles |
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