Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

• Published in: Materials research bulletin Vol. 110; pp. 76 - 81
• Main Authors: Ryu, Beo Deul, Han, Min, Ko, Kang Bok, Lee, Kyu-Han, Cuong, Tran Viet, Han, Nam, Kim, Kyurin, Ryu, Jae Hyung, Park, Noh-Joon, Lim, Yongsu, Thanh, Do Trong, Jo, Chang Hee, Ju, Kwanseon, Hong, Chang-Hee
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.02.2019
• Subjects: Copper nanoparticles; Graphene oxide; Heat dissipation; Thermal resistance; Heat dissipation; Graphene oxide; Thermal resistance; Copper nanoparticles
• ISSN: 0025-5408; 1873-4227
• DOI: 10.1016/j.materresbull.2018.06.028

[Display omitted] •Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized.•The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation.•Analysis by a FLIR camera has showed that the combination of GO and Cu NPs enabled heat dissipation properties.•The thermal resistance of the mixed GO–Cu NPs structure is less 37 % than that of the Al heat sink. Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance was explored by creating two types of samples: spray–coated with a mixed GO–Cu NPs and layer–by–layer stacked with GO/Cu NPs/GO. A reduction of thermal resistance for mixed GO–Cu NPs and layer–by–layer stacked structure by 37% and 33%, respectively, compared to that of Al heat sink. The lower thermal resistance of the mixed GO–Cu NPs sample is attributed to the fact that distributed Cu NPs at the step edge of GO sheets enhances the out–of–plane heat transfer at wrinkles/folds of GO interlayers. Therefore, a mixed GO–Cu NPs is considered as a promising composite for effective thermal management of high–performance optoelectronic devices.