The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step

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Bibliographic Details
Published inJournal of micromechanics and microengineering Vol. 21; no. 2; p. 025020
Main Authors Dixit, Pradeep, Salonen, Jaakko, Pohjonen, Harri, Monnoyer, Philippe
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.02.2011
Institute of Physics
Subjects
Applied sciences
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Micromechanical devices and systems
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Thick film device
Dry etching
Dry
Chemical vapor deposition
Surface treatment
Deposition process
Variable section
Microelectronic fabrication
Reactive ion etching
Plasma etching
Electrodeposition
Silicon
PECVD
Low temperature
Photoresist
Production process
Via hole
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ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/21/2/025020