Processing gamma-based TiAl sheet materials by cyclic cold roll bonding and annealing of elemental titanium and aluminum foils

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 433; no. 1; pp. 334 - 342
• Main Authors: Luo, Jian-Guo, Acoff, Viola L.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 15.10.2006; Elsevier
• Subjects: Aluminum; Annealing; Applied sciences; Cold roll bonding; Diffusion; Exact sciences and technology; Metals. Metallurgy; Multi-layered composites; Powder metallurgy. Composite materials; Production techniques; Technology; Titanium; Titanium; Multi-layered composites; Annealing; Diffusion; Aluminum; Cold roll bonding; Titanium alloy; Scanning electron microscopy; Vickers hardness; Roll cladding; Roll bonding; Aluminium alloy; Dispersive spectrometry; X ray diffraction; Composite material; Cold rolling; Optical microscopy; Thermodynamic properties
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2006.06.120

Previous work by the authors investigated cold roll bonding followed by annealing as a simplistic method for processing Ti/TiAl 3 multi-layered composites from elemental titanium and aluminum foils. In this study, the Ti/TiAl 3 multi-layered composites were subjected to further processing at higher temperatures and increased cyclic cold rolling to promote the formation of gamma-based titanium aluminide (γ-TiAl). The resulting γ-TiAl phase was characterized using light microscopy equipped with digital image analysis, scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), and Vickers microhardness testing. The thermodynamics and kinetics of the diffusion reaction were investigated using differential scanning calorimetry (DSC) and enthalpy ( H), entropy ( S), and capacity ( C) thermodynamic calculations. The physical, chemical, mechanical, and microstructure changes that accompanied the phase transformation to γ-TiAl was discussed.