Modelling the transition from strengthening to softening due to grain boundaries
Published data on pure Cu at or close to its saturation state of deformation suggests a Hall–Petch relation of flow stress at ambient temperature in the range of grain sizes 1 μ m > d > 10 nm [W. Blum, Y.J. Li, J. Chen, X.H. Zeng, K. Lu, Int. J. Mater. Res. 97 (2006) 1661–1666] while for el...
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Published in | Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 483; pp. 95 - 98 |
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Main Authors | , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Amsterdam
Elsevier B.V
15.06.2008
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | Published data on pure Cu at or close to its saturation state of deformation suggests a Hall–Petch relation of flow stress at ambient temperature in the range of grain sizes 1
μ
m
>
d
>
10
nm [W. Blum, Y.J. Li, J. Chen, X.H. Zeng, K. Lu, Int. J. Mater. Res. 97 (2006) 1661–1666] while for elevated temperatures ultrafine-grained Cu produced by severe plastic deformation exhibits softening relative to conventional grain sizes
d
>
10
μ
m
[Y.J. Li, X.H. Zeng, W. Blum, Acta Mater. 52 (2004) 5009–5018]. Presuming grain boundaries as impenetrable dislocation obstacles, these observations are rationalized by (i) a reduction of the mean slipped area and corresponding shift in the main location for dislocation storage from grain interior to boundaries with decreasing
d; (ii) thermally activated dissolution of dislocation dipoles occurring faster at boundaries than within the grain interior owing to different coefficients of diffusion. A simple statistical dislocation model is derived from these ideas and compares to experimental results in semi-quantitative agreement. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0921-5093 1873-4936 |
DOI: | 10.1016/j.msea.2006.09.130 |