Fabrication and characterization of C/SiC composites with large thickness, high density and near-stoichiometric matrix by heaterless chemical vapor infiltration

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 465; no. 1; pp. 290 - 294
• Main Authors: Tang, Sufang, Deng, Jingyi, Wang, Shijun, Liu, Wenchuan
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 15.09.2007; Elsevier
• Subjects: C/SiC composites; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; CVI; Exact sciences and technology; Fatigue, brittleness, fracture, and cracks; Materials science; Materials synthesis; materials processing; Mechanical and acoustical properties of condensed matter; Mechanical properties; Mechanical properties of solids; Nonelectronic thermal conduction and heat-pulse propagation in solids; thermal waves; Physics; Thermal conductivity; Transport properties of condensed matter (nonelectronic); Mechanical properties; Thermal conductivity; C/SiC composites; CVI; Inorganic compounds; Ruptures; Silicon carbides; Compression strength; Fracture toughness; Thickness; Thermal expansion; Composite materials; Flexural strength; Chemical vapor infiltration; Damage; Rupture strength
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2007.02.037

The C/SiC composites with a 7–8 mm thickness, a 2.3–2.4 g/cm 3 density, and a Si/C ratio 1.08–1.09 matrix have been fabricated by heaterless chemical vapor infiltration (CVI) in a 25-h deposition time. The C/SiC composites exhibited a damage-tolerant fracture behavior, and its average flexural strength, longitudinal/transverse compressive strength and fracture toughness were 163 MPa, 304/276 MPa and 6.5 MPa m 1/2, respectively. The composites presented a thermal expansion of (1.09–1.93) × 10 −6 °C −1 and a thermal conductivity (TC) of 8.34–6.56 W/m °C in the range 200–1000 °C.