Abnormalities associated with grain growth in solid solution Cu(Ni) thin films

• Published in: Thin solid films Vol. 558; pp. 170 - 175
• Main Authors: Brons, J.G., Thompson, G.B.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 02.05.2014; Elsevier
• Subjects: Abnormal grain growth; Abnormalities; Alloying; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Deposition by sputtering; Evolution; Exact sciences and technology; Grain boundaries; Grain growth; Grain size distribution; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Precession enhanced diffraction; Segregations; Solid solutions; Structure and morphology; thickness; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology; Thin films; Thin films; Abnormal grain growth; Alloying; Grain growth; Precession enhanced diffraction; Grain size; Grain boundaries; Temperature dependence; Crystal defects; Annealing; Segregation; Transmission electron microscopy; Solid solutions; Physical vapor deposition
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/j.tsf.2014.03.009

A sputter-deposited 80Cu20Ni (at.%) solid solution film was heated in situ using a step-wise annealing schedule within a transmission electron microscope to observe the grain boundary character evolution associated with grain growth. The grain size distribution broadened with increasing temperature with a corresponding increase in the Σ9 and Σ11 boundary fraction. Particular grains grew at a faster rate than others, as compared to a Cu film, and are attributed to Ni segregation to the grain boundaries. •Cu80Ni20 solid solution films were sputter-deposited onto silicon nitride TEM windows.•These alloy thin films were in situ annealed within the TEM.•Grain boundary motion was quantified using precession-enhanced diffraction.•Particular grains grew at a faster rate than the others, as compared to pure Cu.•Σ9 boundaries outlined the largely growing grains within the films.