Efficient heat conducting liquid metal/CNT pads with thermal interface materials
Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This...
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Published in | Bulletin of materials science Vol. 42; no. 4; p. 192 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Bangalore, India
Indian Academy of Sciences
01.08.2019
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
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Abstract | Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (
κ
) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of
κ
reaching
∼
14.2
W
mK
-
1
, greater than that of most of the commercial thermal silicone pads (
∼
5
W
mK
-
1
)
. In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance. |
---|---|
AbstractList | Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (
κ
) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of
κ
reaching
∼
14.2
W
mK
-
1
, greater than that of most of the commercial thermal silicone pads (
∼
5
W
mK
-
1
)
. In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance. Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (κ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of κ reaching ∼14.2 WmK-1, greater than that of most of the commercial thermal silicone pads (∼5WmK-1). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance. |
ArticleNumber | 192 |
Author | Zhao, Liuying Chu, Guang Chu, Sheng Chen, Xuechen |
Author_xml | – sequence: 1 givenname: Liuying surname: Zhao fullname: Zhao, Liuying email: 15198872657@126.com organization: State Key Laboratory of Optoelectronic Materials and Technologies, School of Material Science and Engineering, Sun Yat-Sen University, School of Materials Science and Engineering, Sun Yat-Sen University – sequence: 2 givenname: Sheng surname: Chu fullname: Chu, Sheng organization: State Key Laboratory of Optoelectronic Materials and Technologies, School of Material Science and Engineering, Sun Yat-Sen University, School of Materials Science and Engineering, Sun Yat-Sen University – sequence: 3 givenname: Xuechen surname: Chen fullname: Chen, Xuechen organization: State Key Laboratory of Optoelectronic Materials and Technologies, School of Material Science and Engineering, Sun Yat-Sen University, School of Electronics and Information Technology, Sun Yat-Sen University – sequence: 4 givenname: Guang surname: Chu fullname: Chu, Guang organization: School of Metallurgy and Environment, Central South University |
BookMark | eNp1kM1KAzEYRYNUsFUfwF3AdWwymcnPUkr9gaIu6jpkZpI2ZSbTJhnEtzdlBFeuvrs4935wFmDmB28AuCP4gWDMl5EUmJYIE4mI4AXiF2COJaeIMyZnORcVRiXH_AosYjzgDJYlmYOPtbWuccYnuDc6wWbw7dgk53ewc6fRtbA3SXfL1dsWHnUb4ZdLe5j2JvS6g84nE6xuDOx1Tk538QZc2nzM7e-9Bp9P6-3qBW3en19XjxvU0EomZIkQVW0Ys5YWQtSNIAxXVMpKtrXRTBbGYoFpW1ayzFSdOcqkxZxYjVtNr8H9tHsMw2k0ManDMAafX6pCEsmwFFxmikxUE4YYg7HqGFyvw7ciWJ3FqUmcyj7UWZziuVNMnZhZvzPhb_n_0g-OCnIc |
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ContentType | Journal Article |
Copyright | Indian Academy of Sciences 2019 Indian Academy of Sciences 2019. |
Copyright_xml | – notice: Indian Academy of Sciences 2019 – notice: Indian Academy of Sciences 2019. |
DBID | AAYXX CITATION 7SR 8BQ 8FD 8FE 8FG ABJCF AFKRA BENPR BGLVJ CCPQU D1I DWQXO HCIFZ JG9 KB. PDBOC PQEST PQQKQ PQUKI |
DOI | 10.1007/s12034-019-1872-7 |
DatabaseName | CrossRef Engineered Materials Abstracts METADEX Technology Research Database ProQuest SciTech Collection ProQuest Technology Collection Materials Science & Engineering Collection ProQuest Central ProQuest Central Technology Collection ProQuest One Community College ProQuest Materials Science Collection ProQuest Central Korea SciTech Premium Collection Materials Research Database Materials Science Database Materials Science Collection ProQuest One Academic Eastern Edition (DO NOT USE) ProQuest One Academic ProQuest One Academic UKI Edition |
DatabaseTitle | CrossRef ProQuest Materials Science Collection Materials Research Database Technology Collection Technology Research Database ProQuest One Academic Eastern Edition Materials Science Collection SciTech Premium Collection ProQuest One Community College ProQuest Technology Collection ProQuest SciTech Collection METADEX ProQuest Central Engineered Materials Abstracts ProQuest One Academic UKI Edition ProQuest Central Korea Materials Science & Engineering Collection Materials Science Database ProQuest One Academic |
DatabaseTitleList | ProQuest Materials Science Collection |
Database_xml | – sequence: 1 dbid: 8FG name: ProQuest Technology Collection url: https://search.proquest.com/technologycollection1 sourceTypes: Aggregation Database |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 0973-7669 |
ExternalDocumentID | 10_1007_s12034_019_1872_7 |
GrantInformation_xml | – fundername: National Science Foundation of China grantid: Grant No. 11204097; Grant No. U1530120 |
GroupedDBID | -4Y -58 -5G -BR -EM -Y2 -~C .86 .VR 06C 06D 0R~ 0VY 1SB 2.D 203 23N 28- 2J2 2JN 2JY 2KG 2KM 2LR 2VQ 2WC 2~H 30V 4.4 406 408 40E 5GY 5VS 67Z 6J9 6NX 8TC 8UJ 95- 95. 95~ 96X AAAVM AABHQ AABYN AAFGU AAGCJ AAHNG AAIAL AAIKT AAJKR AANZL AAPBV AARHV AARTL AATNV AATVU AAUCO AAUYE AAWCG AAYFA AAYIU AAYQN AAYTO ABDBF ABDZT ABECU ABFGW ABFTV ABHQN ABJCF ABJNI ABJOX ABKAS ABKCH ABMNI ABMQK ABNWP ABPTK ABQBU ABSXP ABTEG ABTHY ABTKH ABTMW ABULA ABWNU ABXPI ACBMV ACBRV ACBXY ACBYP ACGFO ACGFS ACHSB ACHXU ACIGE ACIPQ ACIWK ACKNC ACMDZ ACMLO ACOKC ACOMO ACREN ACSNA ACTTH ACVWB ACWMK ADHHG ADHIR ADINQ ADKNI ADKPE ADMDM ADOXG ADRFC ADTPH ADURQ ADYFF ADYOE ADZKW AEBTG AEEQQ AEFTE AEGAL AEGNC AEGXH AEJHL AEJRE AEKMD AENEX AEOHA AEPYU AESKC AESTI AETLH AEVLU AEVTX AEXYK AFEXP AFGCZ AFKRA AFLOW AFNRJ AFQWF AFWTZ AFYQB AFZKB AGAYW AGDGC AGGBP AGGDS AGJBK AGMZJ AGQMX AGWIL AGWZB AGYKE AHAVH AHBYD AHKAY AHSBF AHYZX AIAGR AIAKS AIDUJ AIIXL AILAN AIMYW AITGF AJBLW AJDOV AJGSW AJRNO AKQUC ALMA_UNASSIGNED_HOLDINGS ALWAN AMKLP AMTXH AMXSW AMYLF AMYQR AOCGG ARMRJ ASPBG AVWKF AXYYD AYJHY AZFZN B-. BA0 BBWZM BDATZ BENPR BGLVJ BGNMA C1A CAG CCPQU COF CS3 CSCUP DDRTE DNIVK DPUIP DU5 E3Z EAD EAP EBLON EBS EIOEI EJD ESBYG ESX FEDTE FERAY FFXSO FIGPU FINBP FNLPD FRRFC FSGXE FWDCC G-Y G-Z GGCAI GGRSB GJIRD GNWQR GQ6 GQ7 GROUPED_DOAJ HCIFZ HF~ HG5 HG6 HH5 HMJXF HRMNR HVGLF HZ~ I-F IJ- IKXTQ IWAJR IXC IXD IXE I~X I~Z J-C J0Z JBSCW JZLTJ KB. KDC KOV KQ8 LLZTM M4Y MA- MK~ M~E N2Q NDZJH NF0 NPVJJ NQJWS NU0 O9- O93 O9G O9I O9J OK1 P19 P2P P9N PDBOC PF0 PT4 PT5 Q2X QOK QOR QOS R4E R89 R9I RAB RHV RNI RNS ROL RPX RSV RZK S16 S1Z S26 S27 S28 S3B SAP SC5 SCG SCLPG SCM SDH SDM SHX SISQX SNE SNPRN SNX SOHCF SOJ SPISZ SQXTU SRMVM SSLCW STPWE SZN T13 T16 TR2 TSG TSK TSV TUC TUS U2A UG4 UNUBA UOJIU UTJUX UZXMN VC2 VFIZW W48 W4F WK8 XSB YLTOR Z45 Z5O Z7R Z7S Z7V Z7W Z7X Z7Y Z7Z Z83 Z85 Z86 Z88 Z8M Z8N Z8P Z8Q Z8R Z8T Z8W Z8Z Z92 ZMTXR ~8M ~A9 ~EX AACDK AAEOY AAJBT AASML AAYXX ABAKF ACAOD ACDTI ACZOJ AEFQL AEMSY AFBBN AGJZZ AGQEE AGRTI AIGIU CITATION H13 SJYHP 7SR 8BQ 8FD 8FE 8FG D1I DWQXO JG9 PQEST PQQKQ PQUKI |
ID | FETCH-LOGICAL-c359t-f1885be66ff3288bc8160539959dbea692ef0803d459466fbff3369f071fa0da3 |
IEDL.DBID | AGYKE |
ISSN | 0250-4707 |
IngestDate | Thu Oct 10 22:11:01 EDT 2024 Thu Sep 12 17:44:33 EDT 2024 Sat Dec 16 12:03:19 EST 2023 |
IsDoiOpenAccess | false |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 4 |
Keywords | gallium oxide Liquid metal carbon nanotubes thermal conductivity heat-dissipation |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c359t-f1885be66ff3288bc8160539959dbea692ef0803d459466fbff3369f071fa0da3 |
OpenAccessLink | https://www.ias.ac.in/article/fulltext/boms/042/04/0192 |
PQID | 2919609879 |
PQPubID | 326358 |
ParticipantIDs | proquest_journals_2919609879 crossref_primary_10_1007_s12034_019_1872_7 springer_journals_10_1007_s12034_019_1872_7 |
PublicationCentury | 2000 |
PublicationDate | 2019-08-01 |
PublicationDateYYYYMMDD | 2019-08-01 |
PublicationDate_xml | – month: 08 year: 2019 text: 2019-08-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | Bangalore, India |
PublicationPlace_xml | – name: Bangalore, India – name: Bangalore |
PublicationSubtitle | Published by the Indian Academy of Sciences |
PublicationTitle | Bulletin of materials science |
PublicationTitleAbbrev | Bull Mater Sci |
PublicationYear | 2019 |
Publisher | Indian Academy of Sciences Springer Nature B.V |
Publisher_xml | – name: Indian Academy of Sciences – name: Springer Nature B.V |
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SSID | ssj0019441 |
Score | 2.4374843 |
Snippet | Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (
κ
) are indispensable components in thermal management systems. Here, we... Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (κ) are indispensable components in thermal management systems. Here, we... |
SourceID | proquest crossref springer |
SourceType | Aggregation Database Publisher |
StartPage | 192 |
SubjectTerms | Carbon nanotubes Chemistry and Materials Science Composite materials Conduction heating Conductive heat transfer Engineering Heat conductivity Heat transmission Indium Liquid metals Management systems Materials Science Scanning electron microscopy Silicones Smartphones Temperature Thermal conductivity Thermal management |
SummonAdditionalLinks | – databaseName: ProQuest Technology Collection dbid: 8FG link: http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LSwMxEA5aL3oQn1itkoMnJbhJtnmcRIq1CBYPLfS27G4SKNh3-_-d2e66KuhtIcMcJtnMl3l8Q8ht0NohCwiTObbkZC5iqXKGYU4uwrQYV9go_NZXvWH8OmqPyoDbqiyrrO7E4qJ2sxxj5A_CciRHM9o-zhcMp0ZhdrUcobFL9jgy4WGnePflK4tg42JyJbp5FutIV1nNonVORBLrLyzjRgPI_OmXarD5Kz9auJ3uETks8SJ92m7wMdnx0xNy8I1F8JS8Pxc0EOA9KN6sFF64SOIKa_RjvNiMHZ14rBbt9Ad0nroVxdgrReA3Ac3IF7EMae4pYNftcTwjw-7zoNNj5aAElsu2XbPAjWlnXqkQpDAmyw2HVwo2rVqX-VRZ4QMgQ-niNtLJhwzkpLIB4EVII5fKc9KYzqb-gtBUgxD31nseAEkp-MhNLATI5plwsknuKjMl8y0fRlIzH6NNE7BpgjZNdJO0KkMm5a-xSuqNbJL7yrj18p_KLv9XdkX2Be5mUZvXIo31cuOvAS-ss5viUHwC8167JA priority: 102 providerName: ProQuest |
Title | Efficient heat conducting liquid metal/CNT pads with thermal interface materials |
URI | https://link.springer.com/article/10.1007/s12034-019-1872-7 https://www.proquest.com/docview/2919609879 |
Volume | 42 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LT8MwDLbYdoEDb8R4TDlwAnVq01dyHGgPgZgG2qRxqtomkaax8th24ddjdyvjeeDSVo0VqY4bf4ntLwBnJgwVsYBYbkolOYmyrThQwqKYnE1hMSegQuHbbtAZeNdDf7gG_GPrIhvXi4hkPlGvat247VLChLQcESIqLEHFJ76vMlQa7Yeb5kfsQHr5eZXk3C0vtMMilvlbJ1-90QpifouK5s6mtbUoAJzmHIWUYzKuz2dJPX37yeD4j-_Yhs0l9mSNhbHswJrOdmHjEyPhHvSaOaUEeiJGszTD1TIRwmIbexy9zEeKTTRlnl51--w5VlNG-7iMQOQEeybuiVcTp5ohDl6Y9j4MWs3-VcdaHrpgpa4vZ5ZxhPATHQTGuFyIJBUOrnioAFaqRMeB5NogynSV5xM1vUlQzg2kQahiYlvF7gGUs6dMHwKLQxRytNTaMYjKAnxIhcc5yqYJV24VzgvlR88Lbo1oxaJMaopQTRGpKQqrcFIMT7T8zaYRlw4x5olQVuGiUPeq-c_Ojv4lfQzrnMYrT_s7gfLsda5PEYrMkhqURKtdW1og3i-b3d49vr25E3gd8MY7IQ_XxQ |
link.rule.ids | 315,786,790,12792,21416,27955,27956,33406,33777,41114,41556,42183,42625,43633,43838,52144,52267,74390,74657 |
linkProvider | Springer Nature |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV07T8MwELagDMCAeIpCAQ9MIIvETvyYEKpaCrQVQyt1s5LYlirRd_v_8aUJBSTYIvl0w9nxfb7HdwjdOiEMsIAQlkFLTmoCknAjCeTkAkiLhRwahTtd3upHr4N4UATcFkVZZXkn5he1mWQQI3-gKgRyNCnU43RGYGoUZFeLERrbaCdinME5l83nryyCivLJleDmSSQCUWY189Y5GjCov1AklMKDzJ9-aQM2f-VHc7fTPEQHBV7ET-sNPkJbdnyM9r-xCJ6g90ZOA-G9B4abFfsXLpC4-jX8MZythgaPLFSL1rs9PE3MAkPsFQPwG3nNwBcxd0lmsceu6-N4ivrNRq_eIsWgBJKxWC2JC6WMU8u5c4xKmWYy9K8UaFpVJrUJV9Q6jwyZiWKgk3epl2NcOQ8vXBKYhJ2hyngytucIJ8ILhVZZGzqPpLj_yGREqZfNUmpYFd2VZtLTNR-G3jAfg021t6kGm2pRRbXSkLr4NRZ6s5FVdF8ad7P8p7KL_5XdoN1Wr9PW7Zfu2yXao7CzeZ1eDVWW85W98thhmV7nB-QT1va-DA |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDI5gSAgOiKcYDMiBEyha27RNckJoUMZr2mGTdqvaJpEmsff2_7G7lgIS3Col8sF24y-x_ZmQayuERhYQxjNsyUm1w5JQS4Y5OQfTYm6IjcLvnbDd918GwaCof1oUZZXlmZgf1HqS4Rt501MukqNJoZq2KIvoPkR30xnDCVKYaS3GaWySLQTZOMZBRk9fGQXl51MsMeQzXziizHDmbXSew7EWQzFXCgCcP2NUBTx_5UrzEBTtk70CO9L7tbEPyIYZH5Ldb4yCR6T7mFNCQCSheMpSuO0ioSus0Y_hbDXUdGSwcrTV6dFpohcU32EpgsARSEbuiLlNMkMBx65d85j0o8deq82KoQks44FaMutKGaQmDK3lnpRpJl24sWADq9KpSULlGQsokWs_QGp5m8I-HioLUMMmjk74CamNJ2NzSmgiYJNrlDGuBVQVwkcmfc-DvVnqaV4nN6Wa4umaGyOuWJBRpzHoNEadxqJOGqUi4-I3WcSVUevktlRutfynsLP_hV2RbfCN-O2583pOdjw0bF6y1yC15XxlLgBGLNPL3D8-Ab-6wkE |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Efficient+heat+conducting+liquid+metal%2FCNT+pads+with+thermal+interface+materials&rft.jtitle=Bulletin+of+materials+science&rft.au=Zhao%2C+Liuying&rft.au=Chu%2C+Sheng&rft.au=Chen%2C+Xuechen&rft.au=Chu%2C+Guang&rft.date=2019-08-01&rft.issn=0250-4707&rft.eissn=0973-7669&rft.volume=42&rft.issue=4&rft_id=info:doi/10.1007%2Fs12034-019-1872-7&rft.externalDBID=n%2Fa&rft.externalDocID=10_1007_s12034_019_1872_7 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0250-4707&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0250-4707&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0250-4707&client=summon |