Efficient heat conducting liquid metal/CNT pads with thermal interface materials

Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This...

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Published inBulletin of materials science Vol. 42; no. 4; p. 192
Main Authors Zhao, Liuying, Chu, Sheng, Chen, Xuechen, Chu, Guang
Format Journal Article
LanguageEnglish
Published Bangalore, India Indian Academy of Sciences 01.08.2019
Springer Nature B.V
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Abstract Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of κ reaching ∼ 14.2 W mK - 1 , greater than that of most of the commercial thermal silicone pads ( ∼ 5 W mK - 1 ) . In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.
AbstractList Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of κ reaching ∼ 14.2 W mK - 1 , greater than that of most of the commercial thermal silicone pads ( ∼ 5 W mK - 1 ) . In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.
Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (κ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of κ reaching ∼14.2 WmK-1, greater than that of most of the commercial thermal silicone pads (∼5WmK-1). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance.
ArticleNumber 192
Author Zhao, Liuying
Chu, Guang
Chu, Sheng
Chen, Xuechen
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Keywords gallium oxide
Liquid metal
carbon nanotubes
thermal conductivity
heat-dissipation
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Snippet Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we...
Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (κ) are indispensable components in thermal management systems. Here, we...
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StartPage 192
SubjectTerms Carbon nanotubes
Chemistry and Materials Science
Composite materials
Conduction heating
Conductive heat transfer
Engineering
Heat conductivity
Heat transmission
Indium
Liquid metals
Management systems
Materials Science
Scanning electron microscopy
Silicones
Smartphones
Temperature
Thermal conductivity
Thermal management
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Title Efficient heat conducting liquid metal/CNT pads with thermal interface materials
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