Efficient heat conducting liquid metal/CNT pads with thermal interface materials
Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ( κ ) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This...
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Published in | Bulletin of materials science Vol. 42; no. 4; p. 192 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Bangalore, India
Indian Academy of Sciences
01.08.2019
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
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Summary: | Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity (
κ
) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of
κ
reaching
∼
14.2
W
mK
-
1
, greater than that of most of the commercial thermal silicone pads (
∼
5
W
mK
-
1
)
. In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LM/nanotube pads with TIMs show distinguish thermal conductivity performance. |
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ISSN: | 0250-4707 0973-7669 |
DOI: | 10.1007/s12034-019-1872-7 |