Photolithographic patterning of polymer-encapsulated optical oxygen sensors

In this paper we show a novel fabrication process capable of yielding arbitrarily-shaped optical oxygen sensor patterns at micron resolution. The wafer-level process uses a thin-film sacrificial metal layer as intermediate mask, protecting the sensor material and enabling the use of conventional sem...

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Bibliographic Details
Published inMicroelectronic engineering Vol. 87; no. 5; pp. 814 - 816
Main Authors Nock, Volker, Alkaisi, Maan, Blaikie, Richard J.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Amsterdam Elsevier B.V 01.05.2010
Elsevier
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Summary:In this paper we show a novel fabrication process capable of yielding arbitrarily-shaped optical oxygen sensor patterns at micron resolution. The wafer-level process uses a thin-film sacrificial metal layer as intermediate mask, protecting the sensor material and enabling the use of conventional semiconductor patterning techniques. Feature sizes down to 3 μm are demonstrated and only limited by the lithographic process. Gaseous oxygen detection using the patterned sensors shows Stern–Volmer behaviour with a measured intensity ratio I 100/ I 0 of 10.8, the highest reported for a lab-on-a-chip compatible glass substrate. The process has the potential to enable the integration of multiple sensor patches underneath single cells for laterally registered oxygen sensing in cell-culture applications.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2009.11.076