Photolithographic patterning of polymer-encapsulated optical oxygen sensors
In this paper we show a novel fabrication process capable of yielding arbitrarily-shaped optical oxygen sensor patterns at micron resolution. The wafer-level process uses a thin-film sacrificial metal layer as intermediate mask, protecting the sensor material and enabling the use of conventional sem...
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Published in | Microelectronic engineering Vol. 87; no. 5; pp. 814 - 816 |
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Main Authors | , , |
Format | Journal Article Conference Proceeding |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.05.2010
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | In this paper we show a novel fabrication process capable of yielding arbitrarily-shaped optical oxygen sensor patterns at micron resolution. The wafer-level process uses a thin-film sacrificial metal layer as intermediate mask, protecting the sensor material and enabling the use of conventional semiconductor patterning techniques. Feature sizes down to 3
μm are demonstrated and only limited by the lithographic process. Gaseous oxygen detection using the patterned sensors shows Stern–Volmer behaviour with a measured intensity ratio
I
100/
I
0 of 10.8, the highest reported for a lab-on-a-chip compatible glass substrate. The process has the potential to enable the integration of multiple sensor patches underneath single cells for laterally registered oxygen sensing in cell-culture applications. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/j.mee.2009.11.076 |