A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints

• Published in: Journal of electronic materials Vol. 47; no. 5; pp. 2526 - 2544
• Main Authors: Borgesen, Peter, Wentlent, Luke, Hamasha, Sa’d, Khasawneh, Saif, Shirazi, Sam, Schmitz, Debora, Alghoul, Thaer, Greene, Chris, Yin, Liang
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.05.2018; Springer Nature B.V
• Subjects: Accelerated tests; Characterization and Evaluation of Materials; Chemistry and Materials Science; Coalescing; Constitutive relationships; Crack propagation; Damage accumulation; Dislocation pinning; Dynamic recrystallization; Electronics and Microelectronics; Evolution; Fatigue failure; Instrumentation; Materials research; Materials Science; Mechanical tests; Optical and Electronic Materials; Precipitates; Soldered joints; Solid State Physics; Thermal cycling; Thermal cycling tests; Thermal fatigue; model; Reliability; solder; acceleration factor; thermal cycling
• ISSN: 0361-5235; 1543-186X
• DOI: 10.1007/s11664-018-6121-0

The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermal cycling experiments, conducted over many years, has revealed a series of systematic trends that are not compatible with common damage functions or constitutive relations. Complementary mechanical testing and systematic studies of the evolution of the microstructure and damage have led to a fundamental understanding of the progression of thermal fatigue and failure. A special experiment was developed to allow the effective deconstruction of conventional thermal cycling experiments and the finalization of our model. According to this model, the evolution of damage and failure in thermal cycling is controlled by a continuous recrystallization process which is dominated by the coalescence and rotation of dislocation cell structures continuously added to during the high-temperature dwell. The dominance of this dynamic recrystallization contribution is not consistent with the common assumption of a correlation between the number of cycles to failure and the total work done on the solder joint in question in each cycle. It is, however, consistent with an apparent dependence on the work done during the high-temperature dwell. Importantly, the onset of this recrystallization is delayed by pinning on the Ag 3 Sn precipitates until these have coarsened sufficiently, leading to a model with two terms where one tends to dominate in service and the other in accelerated thermal cycling tests. Accumulation of damage under realistic service conditions with varying dwell temperatures and times is also addressed.