Development of the MOSAIX chip for the ALICE ITS3 upgrade

Following the ALICE ITS3 detector development path of wafer-scale monolithic stitched pixel detector prototypes (MOSS & MOST) in the TPSCo. 65 nm CMOS imaging technology, the MOSAIX chip is the prototype of the final full-size and full-functionality ITS3 sensor. MOSAIX has a die size of 26.6 × 1...

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Bibliographic Details
Published inJournal of instrumentation Vol. 20; no. 6; p. C06001
Main Author Vicente Leitao, P.
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.06.2025
Subjects
Manufacturing defects
Particle detectors
Particle tracking detectors
Pixels
Prototypes
Radiation-hard electronics
VLSI circuits
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ISSN1748-0221
1748-0221
DOI10.1088/1748-0221/20/06/C06001

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Summary:Following the ALICE ITS3 detector development path of wafer-scale monolithic stitched pixel detector prototypes (MOSS & MOST) in the TPSCo. 65 nm CMOS imaging technology, the MOSAIX chip is the prototype of the final full-size and full-functionality ITS3 sensor. MOSAIX has a die size of 26.6 × 1.96 cm 2 with an active area exceeding 93 %. It has 144 sensor tiles which can be powered down individually to compensate for manufacturing defects, where each tile has 69.2k pixels with a 22.8 × 20.8 µm 2 pixel size. This contribution provides an overview of the architectural decisions in MOSAIX, highlighting key lessons from the MOSS and MOST prototypes with a focus on yield enhancement techniques.
Bibliography:JINST_049P_1124
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ISSN:1748-0221
1748-0221
DOI:10.1088/1748-0221/20/06/C06001