Sn-Cu-Ni Soldering Process Optimization Using Multivariate Analysis

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 2; no. 3; pp. 527 - 535
• Main Authors: Huang, Chien-Yi, Huang, Hui-Hua, Ying, Kuo-Ching
• Format: Journal Article
• Language: English
• Published: Piscataway, NJ IEEE 01.03.2012; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Copper; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Lead-free solder; Materials; multivariate analysis; Optimization; Pins; Principal component analysis; process optimization; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silver; Sn-Cu-Ni solder; Soldering; Solders; Studies; Temperature; Thermal cycling; Thermal cycling tests; Tin; Wave soldering; Wave soldering; Performance evaluation; Thermal cycle; Solder metal; process optimization; Lead-free solder; Multivariate analysis; Optimization; Sn-Cu-Ni solder; Silver; Integrated circuit bonding; Soldered joint; Quality control; Lead free soldering; Copper; Thermal test; Manufacturing cost; Cost lowering; Nickel alloy; Principal component analysis
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2011.2177093

One lead free solder candidate, Sn-Ag-Cu305 (Sn96.5/Ag3.0/Cu0.5), has come into widespread use as a replacement for traditional tin-lead solder (Sn63/Pb37). However, the price of silver has increased dramatically in recent years. This has increased manufacturing costs, impacting firm competitiveness. This paper evaluates the performance of the low cost Sn-Cu-Ni solder alloy used for wave soldering. Sample products for several applications are used to assess critical factors in the wave soldering process. A principal component analysis was performed in this paper to integrate multiple quality characteristics, namely assembly yield and solder joint strength, for process development. As a result, a parameter combination of 270 soldering temperature and 8 s dwell time is recommended. A test vehicle with daisy-chain circuitry design is used to investigate the performance of samples prepared by the optimal process. Samples are subject to the thermal cycling test. The performance of the recommended process is therefore verified.