Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

• Published in: Microelectronic engineering Vol. 85; no. 11; pp. 2202 - 2206
• Main Authors: Eom, Yong-Sung, Jang, Keonsoo, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.11.2008; Elsevier Science
• Subjects: Anisotropic conductive adhesive; Applied sciences; Design. Technologies. Operation analysis. Testing; Electrical resistance; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; High reliability; Integrated circuits; Low melting point solder; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Anisotropic conductive adhesive; Electrical resistance; High reliability; Low melting point solder; Flip chip bonding; Conducting material; Shear strength; Polymer; Integrated circuit bonding; Optical microscopy; Interconnection; Electronic packaging; Soldered joint; Integrated circuit; Reliability; Current density; Resistor; Electrical characteristic; Adhesive material; Rheological properties
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2008.05.038

For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering the chemo-rheological properties of a polymer matrix and solder was proposed. The bonding mechanism of the new ACA system was experimentally observed by the optical microscope. The electrical properties such as electrical resistance of about 5.6 mΩ and current density of 10,000 A/cm 2 were measured by the 4-point probe test. The measured shear strength was 304 MPa after bonding process. Electrical and mechanical performances were measured and compared before and after a pressure cooker test (PCT). In order to get a more stable ACA system during processing, the polymer matrix mixed with a reductant and a low melting point solder powder will be continuously developed in the near future.