Island grains of low misorientation angles formed during abnormal grain growth in Cu

• Published in: Metallurgical and materials transactions. A, Physical metallurgy and materials science Vol. 31; no. 5; pp. 1489 - 1491
• Main Authors: JAE BON KOO, DUK YONG YOON, HENRY, M. F
• Format: Journal Article
• Language: English
• Published: New York, NY Springer 01.05.2000; Springer Nature B.V
• Subjects: ANNEALING; Applied sciences; COPPER; Cross-disciplinary physics: materials science; rheology; DATA; DEFORMATION; Exact sciences and technology; GRAIN GROWTH; GRAIN ORIENTATION; GRAIN SIZE; MATERIALS SCIENCE; Metals. Metallurgy; Physics; RECRYSTALLIZATION; Solid solution hardening, precipitation hardening, and dispersion hardening; aging; Solid solution, precipitation, and dispersion hardening; aging; TEMPERATURE RANGE 1000-4000 K; Treatment of materials and its effects on microstructure and properties; Grain boundary misorientation; Group IB metal; Grain growth; Coalescence; Copper; Experimental study; Microstructure; Heat treatments
• ISSN: 1073-5623; 1543-1940
• DOI: 10.1007/s11661-000-0267-z

In this work, the earlier suggestion by Rosi et al. on the basis of the nearly parallel twins that the island grains trapped in the large grains during abnormal grain growth (AGG) in Ag have small misorientation angles has been confirmed by electron backscattered pattern (EBSP) in Cu. The formation of the island grains is consistent with the low mobility and energy of the low angle grain boundaries. The island grains shrink and disappear during further annealing treatments. Precise measurement of the shrinkage rate might be useful for determining the migration mechanism of these grain boundaries. The possibility that the grains of even large misorientation angles might be also trapped in the growing grains under certain conditions needs to be further examined.