Development of a very large-area ultraviolet imprint lithography process

We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the production of display panels. This process uses a large-area hard stamp in a low vacuum environment. The hard quartz stamp is used to achieve high ove...

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Published inMicroelectronic engineering Vol. 86; no. 10; pp. 1983 - 1988
Main Authors Kim, Ki-don, Jeong, Jun-ho, Park, Sang-hu, Choi, Dae-geun, Choi, Jun-hyuk, Lee, Eung-sug
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.10.2009
Elsevier
Subjects
Applied sciences
Auto release
Electronics
Exact sciences and technology
Hard stamp
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Ultraviolet imprint process
Vacuum environment
Vacuum environment
Auto release
Ultraviolet imprint process
Hard stamp
Microelectronic fabrication
Patterning
UV lithography
Numerical method
Photolithography
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Abstract We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the production of display panels. This process uses a large-area hard stamp in a low vacuum environment. The hard quartz stamp is used to achieve high overlay accuracy, and the vacuum environment is required to ensure that air bubble defects do not occur during imprinting. We demonstrate that the quartz stamp with microscale patterns can be used for imprinting 18-in. diagonal substrates via single-step UV imprint in a low vacuum environment to obtain a practical residual layer thickness (RLT) for micro pattern transfer to the substrate. Numerical analysis is performed to clarify the physical phenomena underlying imprint process.
AbstractList We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the production of display panels. This process uses a large- area hard stamp in a low vacuum environment. The hard quartz stamp is used to achieve high overlay accuracy, and the vacuum environment is required to ensure that air bubble defects do not occur during imprinting. We demonstrate that the quartz stamp with microscale patterns can be used for imprinting 18-in. diagonal substrates via single-step UV imprint in a low vacuum environment to obtain a practical residual layer thickness (RLT) for micro pattern transfer to the substrate. Numerical analysis is performed to clarify the physical phenomena underlying imprint process.
Author Kim, Ki-don
Park, Sang-hu
Choi, Jun-hyuk
Lee, Eung-sug
Jeong, Jun-ho
Choi, Dae-geun
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Issue 10
Keywords Vacuum environment
Auto release
Ultraviolet imprint process
Hard stamp
Microelectronic fabrication
Patterning
UV lithography
Numerical method
Photolithography
Language English
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Snippet We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the...
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StartPage 1983
SubjectTerms Applied sciences
Auto release
Electronics
Exact sciences and technology
Hard stamp
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Ultraviolet imprint process
Vacuum environment
Title Development of a very large-area ultraviolet imprint lithography process
URI https://dx.doi.org/10.1016/j.mee.2008.12.068
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