Development of a very large-area ultraviolet imprint lithography process

• Published in: Microelectronic engineering Vol. 86; no. 10; pp. 1983 - 1988
• Main Authors: Kim, Ki-don, Jeong, Jun-ho, Park, Sang-hu, Choi, Dae-geun, Choi, Jun-hyuk, Lee, Eung-sug
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.10.2009; Elsevier
• Subjects: Applied sciences; Auto release; Electronics; Exact sciences and technology; Hard stamp; Microelectronic fabrication (materials and surfaces technology); Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Ultraviolet imprint process; Vacuum environment; Vacuum environment; Auto release; Ultraviolet imprint process; Hard stamp; Microelectronic fabrication; Patterning; UV lithography; Numerical method; Photolithography
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2008.12.068

We propose a very large-area ultraviolet imprint lithography process as a promising alternative to expensive conventional optical lithography for the production of display panels. This process uses a large-area hard stamp in a low vacuum environment. The hard quartz stamp is used to achieve high overlay accuracy, and the vacuum environment is required to ensure that air bubble defects do not occur during imprinting. We demonstrate that the quartz stamp with microscale patterns can be used for imprinting 18-in. diagonal substrates via single-step UV imprint in a low vacuum environment to obtain a practical residual layer thickness (RLT) for micro pattern transfer to the substrate. Numerical analysis is performed to clarify the physical phenomena underlying imprint process.