Layer-by-layer UV micromachining methodology of epoxy resist embedded microchannels

A novel layer-by-layer fabrication approach for the manufacturing of long embedded microchannels is presented. The methodology is based on the use of two epoxy based photoresist layers with different photo acid generator (PAG) concentration. Using this methodology long, functional microchannels are...

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Bibliographic Details
Published inMicroelectronic engineering Vol. 83; no. 4; pp. 1298 - 1301
Main Authors Kitsara, M., Chatzichristidi, M., Niakoula, D., Goustouridis, D., Beltsios, K., Argitis, P., Raptis, I.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Amsterdam Elsevier B.V 01.04.2006
Elsevier Science
Subjects
Applied sciences
Electronics
Embedded microchannels
Epoxy resist
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
UV lithography
UV lithography
Embedded microchannels
Epoxy resist
Microelectronic fabrication
Micromachining
Resist
Photolithography
Microfluidics
Optimization
Photoresist
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Summary:A novel layer-by-layer fabrication approach for the manufacturing of long embedded microchannels is presented. The methodology is based on the use of two epoxy based photoresist layers with different photo acid generator (PAG) concentration. Using this methodology long, functional microchannels are demonstrated. The technology has been optimized through tuning of the epoxy molecular weight, PAG concentrations and processing conditions. Finally, a basic microfluidic application is presented.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2006.01.157