Low cycle fatigue models for lead-free solders
Low cycle fatigue (LCF) tests for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders were conducted for two conditions of 25 °C at 1 Hz and 125 °C at 0.001Hz. The effect of higher temperature and slower frequency reduces low cycle fatigue endurance. Low cycle fatigue models for 95.5Sn–3.8Ag–0.7Cu a...
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Published in | Thin solid films Vol. 462; no. Complete; pp. 408 - 412 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
01.09.2004
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Subjects | |
Online Access | Get full text |
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Summary: | Low cycle fatigue (LCF) tests for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders were conducted for two conditions of 25 °C at 1 Hz and 125 °C at 0.001Hz. The effect of higher temperature and slower frequency reduces low cycle fatigue endurance. Low cycle fatigue models for 95.5Sn–3.8Ag–0.7Cu and 99.3Sn–0.7Cu Pb-free solders are presented in Coffin–Manson and Morrow models. Comparison with reported Pb-free solder low cycle fatigue properties provides an evaluation of the relative fatigue endurance of Pb-free and Pb-based solders. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2004.05.037 |