Physical and Mechanical Properties of Fiberboard Made of MDF Residues and Phase Change Materials

• Published in: Forests Vol. 15; no. 5; p. 802
• Main Authors: Rodríguez, Gustavo E., Bustos Ávila, Cecilia, Cloutier, Alain
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.05.2024
• Subjects: Adhesives; Comparative analysis; Control boards; Density; Fiberboard; Formaldehyde; Heat conductivity; Manufacturing; MDF residues; Mechanical properties; Modulus of elasticity; Modulus of rupture; Moisture content; Moldings; Phase change materials; Phenol formaldehyde; Phenols; Physical properties; physical-mechanical properties; Residues; Specific heat; Swelling; Testing; Thermal energy; thermal energy storage; Thermal properties; Thermodynamic properties; Thickness; Urea; Water absorption; Chile; Canada; United States > US
• ISSN: 1999-4907; 1999-4907
• DOI: 10.3390/f15050802

The wood-based panel industry is experiencing an excessive accumulation of solid residues from the production of medium-density fiberboard (MDF) panels and moldings. It is possible to create new MDF products with acceptable physical and mechanical properties by revaluing MDF residues. Additionally, those products’ thermal properties can be improved by incorporating phase change materials (PCMs). This study aims to develop a wood-based fiberboard made of MDF residues, capable of storing thermal energy. Two types of PCMs (liquid and microencapsulated), two PCM ratios (2% and 6%), and two types of adhesives (urea-formaldehyde and phenol-formaldehyde) were used to produce eight different types of panels. The vertical density profile, thickness swelling, water absorption, internal bond (IB), and static bending properties—modulus of elasticity (MOE) and modulus of rupture (MOR)—were determined for each panel type. The specific heat of the panels was also determined. The results show the panels’ densities were greater than 700 kg/m3. Thickness swelling in water improved by 23% compared to the reference value of the control panel PCMs after PCM incorporation. The highest IB value was 1.30 MPa, which is almost three times the minimum required by regulation standards. The incorporation of PCMs reduced the panels’ bending properties compared to the properties of the control panels. Even though the values obtained are sufficient to comply with the minimum values set out in ANSI standard A208.2 with an MOE value of 2072.4 MPa and the values obtained are sufficient to comply with the minimum standards with an MOE value of 2072.4 MPa and an MOR value of 16.4 MPa, when microencapsulated PCM is used, the specific heat of the panels is increased by more than 100% over that of the control panels. This study developed fiberboards with adequate physical and mechanical properties and capable of storing thermal energy.